Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9456506 | Packaging for eight-socket one-hop SMP topology | John L. Colbert, Daniel M. Dreps, Paul M. Harvey | 2016-09-27 |
| 9445507 | Packaging for eight-socket one-hop SMP topology | John L. Colbert, Daniel M. Dreps, Paul M. Harvey | 2016-09-13 |
| 9277653 | Through-hole-vias in multi-layer printed circuit boards | Moises Cases, Tae Hong Kim, Nusrat I. Sherali | 2016-03-01 |
| 9232645 | High speed differential wiring in glass ceramic MCMS | Jinwoo Choi, Daniel M. Dreps | 2016-01-05 |
| 9232646 | High speed differential wiring in glass ceramic MCMS | Jinwoo Choi, Daniel M. Dreps | 2016-01-05 |