Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9277653 | Through-hole-vias in multi-layer printed circuit boards | Moises Cases, Tae Hong Kim, Rohan U. Mandrekar | 2016-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9277653 | Through-hole-vias in multi-layer printed circuit boards | Moises Cases, Tae Hong Kim, Rohan U. Mandrekar | 2016-03-01 |