Issued Patents 2016
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9313920 | Direct coolant contact vapor condensing | Levi A. Campbell, Richard C. Chu, Milnes P. David, Dustin W. Demetriou, Madhusudan K. Iyengar +2 more | 2016-04-12 |
| 9303926 | Condenser fin structures facilitating vapor condensation cooling of coolant | Levi A. Campbell, Richard C. Chu, Madhusudan K. Iyengar, Robert E. Simons | 2016-04-05 |
| 9298231 | Methods of fabricating a coolant-cooled electronic assembly | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever, Richard P. Snider | 2016-03-29 |
| 9301433 | Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater | Levi A. Campbell, Richard C. Chu, Madhusudan K. Iyengar, Robert E. Simons | 2016-03-29 |
| 9295181 | Coolant-conditioning unit with automated control of coolant flow valves | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-03-22 |
| 9291281 | Thermostat-controlled coolant flow within a heat sink | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-03-22 |
| 9288932 | Ground-based heat sink facilitating electronic system cooling | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-03-15 |
| 9285050 | Thermostat-controlled coolant flow within a heat sink | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-03-15 |
| 9282678 | Field-replaceable bank of immersion-cooled electronic components and separable heat sinks | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-03-08 |
| 9282675 | Thermal expansion-enhanced heat sink for an electronic assembly | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Robert E. Simons +1 more | 2016-03-08 |
| 9261308 | Pump-enhanced, sub-cooling of immersion-cooling fluid | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-02-16 |
| 9265178 | Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever, Richard P. Snider | 2016-02-16 |
| 9265177 | Fabricating multi-component electronic module with integral coolant-cooling | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever | 2016-02-16 |
| 9265176 | Multi-component electronic module with integral coolant-cooling | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever | 2016-02-16 |
| 9258925 | Selective clamping of electronics card to coolant-cooled structure | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Randall G. Kemink +1 more | 2016-02-09 |
| 9253921 | Coolant-conditioning unit with automated control of coolant flow valves | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-02-02 |
| 9253923 | Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever, Richard P. Snider | 2016-02-02 |
| 9250024 | Pump-enhanced, sub-cooling of immersion-cooling fluid | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2016-02-02 |