Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497888 | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider | 2016-11-15 |
| 9496194 | Customized module lid | Michael J. Ellsworth, Jr., Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2016-11-15 |
| 9490188 | Compute intensive module packaging | Michael J. Ellsworth, Jr., Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2016-11-08 |
| 9453972 | Pluggable module for heat removal device | Alan F. Benner, Michael J. Ellsworth, Jr., David P. Graybill, Eric J. McKeever | 2016-09-27 |
| 9456527 | Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-09-27 |
| 9341418 | Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Mark A. Brandon, Levi A. Campbell, Michael J. Ellsworth, Jr., Randall G. Kemink, Eric J. McKeever | 2016-05-17 |
| 9298231 | Methods of fabricating a coolant-cooled electronic assembly | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider | 2016-03-29 |
| 9265178 | Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider | 2016-02-16 |
| 9265177 | Fabricating multi-component electronic module with integral coolant-cooling | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-02-16 |
| 9265176 | Multi-component electronic module with integral coolant-cooling | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-02-16 |
| 9258925 | Selective clamping of electronics card to coolant-cooled structure | Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr., Randall G. Kemink +1 more | 2016-02-09 |
| 9253923 | Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider | 2016-02-02 |