Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510459 | Environmental sensitive electronic device package and manufacturing method thereof | Jing-Yi Yan, Shu-Tang Yeh, Sheng-Wei Chen | 2016-11-29 |
| 9449822 | Method of forming semiconductor structures with contact holes | Wai-Kin Li, Wu-Song Huang, Joy Cheng | 2016-09-20 |
| 9450202 | Environmental sensitive electronic device package having side wall barrier structure | — | 2016-09-20 |
| 9412967 | Foldable package structure | Cheng-Chung Lee | 2016-08-09 |
| 9316916 | Method to mitigate resist pattern critical dimension variation in a double-exposure process | Wu-Song Huang, Wai-Kin Li | 2016-04-19 |
| 9288897 | Environmental sensitive electronic device package | Wei-Yi Lin | 2016-03-15 |
| 9252389 | Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof | — | 2016-02-02 |
| 9235119 | Exposure photolithography methods | Wu-Song Huang, Ranee W. Kwong, Sen Liu, Pushkara R. Varanasi | 2016-01-12 |