Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9392690 | Method and structure to improve the conductivity of narrow copper filled vias | Chih-Chao Yang | 2016-07-12 |
| 9343407 | Method to fabricate copper wiring structures and structures formed thereby | Chih-Chao Yang | 2016-05-17 |