Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Katsuyuki Masuda, Yoshinori Ejiri +2 more | 2016-10-04 |