Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda, Yoshinori Ejiri +2 more | 2016-10-04 |
| 9340308 | Supply apparatus for spout-equipped bags | Koichi Nakagawa, Yoshikatsu Nakahara | 2016-05-17 |
| 9340309 | Supply apparatus for spout-equipped bags | Koichi Nakagawa, Yoshikatsu Nakahara | 2016-05-17 |