Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449938 | Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof | Pukun Zhu, Shashi Gupta, Andrew Christopher Laib | 2016-09-20 |
| 9362105 | Pre-cut wafer applied underfill film on dicing tape | YounSang Kim, Rose Guino | 2016-06-07 |
| 9305892 | Adhesive for electronic component | Sugiura Yoko, Horiguchi Yusuke, Mieko Sano | 2016-04-05 |
| 9281182 | Pre-cut wafer applied underfill film | YounSang Kim, Rose Guino | 2016-03-08 |