Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9334429 | Underfill sealant composition | Yusuke Horiguchi, Kenichiro Sato | 2016-05-10 |
| 9305892 | Adhesive for electronic component | Sugiura Yoko, Horiguchi Yusuke, Gina Hoang | 2016-04-05 |