Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455188 | Through silicon via device having low stress, thin film gaps and methods for forming the same | Huang Liu, Chun Yu Wong | 2016-09-27 |
| 9245790 | Integrated circuits and methods of forming the same with multiple embedded interconnect connection to same through-semiconductor via | Chun Yu Wong | 2016-01-26 |
| 9236301 | Customized alleviation of stresses generated by through-substrate via(S) | Guoxiang Ning, Xiang Hu, Paul Ackmann | 2016-01-12 |