Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490171 | Wafer processing method | — | 2016-11-08 |
| 9490155 | Wafer processing method using adhesive layer UV curing step and laser modified layer forming step to singulate individual device chips | — | 2016-11-08 |
| 9444334 | DC/DC converter | Hiroaki Nakamura, Takayuki Konishi, Chie Isshi, Satoshi Nakamoto | 2016-09-13 |
| 9401642 | Switching power-supply device | — | 2016-07-26 |
| 9379016 | Wafer processing method | — | 2016-06-28 |
| 9318956 | Switching power-supply device | — | 2016-04-19 |
| 9280164 | Switching power-supply device and method for manufacturing switching power-supply device | Jung-Soo Lee, Satoshi Nakamoto, Chie Isshi | 2016-03-08 |
| 9269624 | Wafer processing method | Kimitake Mantoku | 2016-02-23 |
| 9270177 | Switching power-supply device | — | 2016-02-23 |