FM

Francois Marion

CEA: 2 patents #97 of 991Top 10%
📍 Saint-Égrève, FR: #5 of 77 inventorsTop 7%
Overall (2016): #143,392 of 481,213Top 30%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9406662 Flip-chip assembly process comprising pre-coating interconnect elements Alexis Bedoin, Frédéric BERGER, Alain Gueugnot 2016-08-02
9368473 Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method 2016-06-14