AB

Alexis Bedoin

CEA: 2 patents #97 of 991Top 10%
📍 Firminy, FR: #2 of 6 inventorsTop 35%
Overall (2016): #162,105 of 481,213Top 35%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9406662 Flip-chip assembly process comprising pre-coating interconnect elements Francois Marion, Frédéric BERGER, Alain Gueugnot 2016-08-02
9368472 Flip-chip assembly process for connecting two components to each other Baptiste Goubault de Brugiere 2016-06-14