Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299735 | Image sensor package structure and method | Qiong Yu, Wei-Chung Wang | 2016-03-29 |
| 9231018 | Wafer level packaging structure for image sensors and wafer level packaging method for image sensors | Qiong Yu, Wei-Chung Wang | 2016-01-05 |