Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455298 | Wafer-level packaging method of BSI image sensors having different cutting processes | Zhi Wang, Wei-Chung Wang | 2016-09-27 |
| 9305961 | Wafer-level packaging method of BSI image sensors having different cutting processes | Zhi Wang, Wei-Chung Wang | 2016-04-05 |
| 9299735 | Image sensor package structure and method | Zhiqi Wang, Wei-Chung Wang | 2016-03-29 |
| 9231018 | Wafer level packaging structure for image sensors and wafer level packaging method for image sensors | Zhiqi Wang, Wei-Chung Wang | 2016-01-05 |