Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287217 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Baek Soung PARK, Jae Won Choi, Sung Min Kim, In Hwan Kim, Jun-Woo Lee | 2016-03-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287217 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Baek Soung PARK, Jae Won Choi, Sung Min Kim, In Hwan Kim, Jun-Woo Lee | 2016-03-15 |