Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287217 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Jae Won Choi, Sung Min Kim, In Hwan Kim, Jun-Woo Lee, Su Ml Im | 2016-03-15 |
| 9240364 | Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device | Jae Won Choi, In Hwan Kim, Gyu Seok Song, Su Mi Lim | 2016-01-19 |