Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai | 2016-11-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai | 2016-11-01 |