Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh | 2016-11-01 |
| 9269673 | Semiconductor device packages | I-Chia Lin, Chieh-Chen Fu, Cheng-Nan Lin | 2016-02-23 |