Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film | Chang-Hwang Hua | 2011-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film | Chang-Hwang Hua | 2011-08-23 |