Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033011 | Method for mounting a thinned semiconductor wafer on a carrier substrate | Jason Chou, Ping Wei CHEN, Sen Yang | 2011-10-11 |
| 8003532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film | Wen Chu | 2011-08-23 |