Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Douglas N. Modlin, Sammy Mok +3 more | 2011-02-08 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Douglas N. Modlin, Sammy Mok +3 more | 2011-01-18 |