Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952373 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Fu Chiung Chong | 2011-05-31 |
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-02-08 |
| 7876087 | Probe card repair using coupons with spring contacts and separate atachment points | Frank Swiatowiec, Fariborz Agahdel | 2011-01-25 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-01-18 |