Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901797 | Low-adhesion material, resin molding die, and soil resistant material | Takaki Kuno, Keiji Maeda, Satoshi Kitaoka, Naoki Kawashima | 2011-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901797 | Low-adhesion material, resin molding die, and soil resistant material | Takaki Kuno, Keiji Maeda, Satoshi Kitaoka, Naoki Kawashima | 2011-03-08 |