Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8045898 | Powder conveyance unit and image forming apparatus including same | — | 2011-10-25 |
| 7901797 | Low-adhesion material, resin molding die, and soil resistant material | Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Naoki Kawashima | 2011-03-08 |