Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048781 | Methods and systems for packaging integrated circuits | — | 2011-11-01 |
| 8030138 | Methods and systems of packaging integrated circuits | Shee Min Yeong, Peng-Soon Lim, Sek Hoi Chong | 2011-10-04 |
| 8018050 | Integrated circuit package with integrated heat sink | Shee Min Yeong | 2011-09-13 |
| 7868433 | Low stress cavity package | Peng-Soon Lim, Shee Min Yeong | 2011-01-11 |
| 7863757 | Methods and systems for packaging integrated circuits | Shee Min Yeong | 2011-01-04 |