Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030138 | Methods and systems of packaging integrated circuits | You Chye How, Peng-Soon Lim, Sek Hoi Chong | 2011-10-04 |
| 8018050 | Integrated circuit package with integrated heat sink | You Chye How | 2011-09-13 |
| 7998791 | Panel level methods and systems for packaging integrated circuits with integrated heat sinks | Sek Hoi Chong, Danny Cher Hau Koh, Eugene Wong | 2011-08-16 |
| 7868433 | Low stress cavity package | Peng-Soon Lim, You Chye How | 2011-01-11 |
| 7863757 | Methods and systems for packaging integrated circuits | You Chye How | 2011-01-04 |