Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989949 | Heat extraction from packaged semiconductor chips, scalable with chip area | Siva Prakash Gurrum, Gregory E. Howard | 2011-08-02 |
| 7981258 | Thin-film shape memory alloy device and method | A. Johnson, Arani Bose, Valery Martynov | 2011-07-19 |
| 7956456 | Thermal interface material design for enhanced thermal performance and improved package structural integrity | Siva Prakash Gurrum, Paul J. Hundt | 2011-06-07 |
| 7892889 | Array-processed stacked semiconductor packages | Gregory E. Howard, Darvin R. Edwards | 2011-02-22 |