Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989949 | Heat extraction from packaged semiconductor chips, scalable with chip area | Vikas Gupta, Gregory E. Howard | 2011-08-02 |
| 7956456 | Thermal interface material design for enhanced thermal performance and improved package structural integrity | Paul J. Hundt, Vikas Gupta | 2011-06-07 |