Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058706 | Delamination resistant packaged die having support and shaped die having protruding lip on support | Chien-Te Feng, Frank Yu, Trevor Liu | 2011-11-15 |
| 7893544 | Semiconductor device having improved contacts | — | 2011-02-22 |