Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058706 | Delamination resistant packaged die having support and shaped die having protruding lip on support | Kazuaki Ano, Frank Yu, Trevor Liu | 2011-11-15 |
| 8039955 | Mold lock on heat spreader | Frank Yu | 2011-10-18 |
| 8008131 | Semiconductor chip package assembly method and apparatus for countering leadfinger deformation | Kevin Jin | 2011-08-30 |
| 7928544 | Semiconductor chip package assembly with deflection- resistant leadfingers | Yuan-Pao Cheng, Li-Chaio Chou | 2011-04-19 |