Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906844 | Multiple integrated circuit die package with thermal performance | Cheng Qiang Cui | 2011-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906844 | Multiple integrated circuit die package with thermal performance | Cheng Qiang Cui | 2011-03-15 |