Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985672 | Solder ball attachment ring and method of use | Poh Leng Eu, Lan Chu Tan | 2011-07-26 |
| 7906844 | Multiple integrated circuit die package with thermal performance | Chee Wah Cheung | 2011-03-15 |