YT

Ying-Hsiu Tsai

TSMC: 1 patents #282 of 830Top 35%
Overall (2011): #124,631 of 364,097Top 35%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8021992 High aspect ratio gap fill application using high density plasma chemical vapor deposition Joung-Wei Liou, Tsang-Yu Liu, Chien-Feng Lin, Cheng-Liang Chang, Ming-Te Chen +3 more 2011-09-20