Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932608 | Through-silicon via formed with a post passivation interconnect structure | Ming-Hong Tseng | 2011-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932608 | Through-silicon via formed with a post passivation interconnect structure | Ming-Hong Tseng | 2011-04-26 |