Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932608 | Through-silicon via formed with a post passivation interconnect structure | Sheng Huang Jao | 2011-04-26 |
MT
Ming-Hong Tseng
Overall (2011): #210,489 of 364,097Top 60%
1
Patents 2011