Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994638 | Semiconductor chip and semiconductor device | Yoshihiro Tomura, Kazuhiro Nobori, Kentaro Kumazawa, Teppei Iwase | 2011-08-09 |
| 7952177 | Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads | Tomoki KAWASAKI, Toshiyuki Fukuda, Shuichi Ogata | 2011-05-31 |