Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952177 | Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads | Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata | 2011-05-31 |