PF

Po Yu Feng

SC Stats Chippac: 1 patents #96 of 188Top 55%
Overall (2011): #192,261 of 364,097Top 55%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7952209 Integrated circuit package system with pad to pad bonding Cheng Yu Hsia 2011-05-31