Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035205 | Molding compound flow controller | Seong Won Park, Yong Suk Kim | 2011-10-11 |
| 7952209 | Integrated circuit package system with pad to pad bonding | Po Yu Feng | 2011-05-31 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035205 | Molding compound flow controller | Seong Won Park, Yong Suk Kim | 2011-10-11 |
| 7952209 | Integrated circuit package system with pad to pad bonding | Po Yu Feng | 2011-05-31 |