Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932131 | Reduction of package height in a stacked die configuration | Kevin Guan, Changhak Lee, Lai Nguk Chin, Royce Yeoh Kao Tziat, Foong Yue Ho | 2011-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932131 | Reduction of package height in a stacked die configuration | Kevin Guan, Changhak Lee, Lai Nguk Chin, Royce Yeoh Kao Tziat, Foong Yue Ho | 2011-04-26 |