LC

Lai Nguk Chin

SL Spansion Llc.: 1 patents #106 of 260Top 45%
Overall (2011): #237,410 of 364,097Top 70%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7932131 Reduction of package height in a stacked die configuration Sally Foong, Kevin Guan, Changhak Lee, Royce Yeoh Kao Tziat, Foong Yue Ho 2011-04-26