Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063318 | Electronic component with wire bonds in low modulus fill encapsulant | Susan Williams, Kiangkai Tankongchumruskul | 2011-11-22 |
| 8039974 | Assembly of electronic components | Kia Silverbrook, Kiangkai Tankongchumruskul | 2011-10-18 |
| 8025204 | Method of wire bond encapsulation profiling | Kiangkai Tankongchumruskul, Kia Silverbrook | 2011-09-27 |
| 7988033 | Method of reducing wire bond profile height in integrated circuits mounted to circuit boards | Kiangkai Tankongchumruskul, Kia Silverbrook | 2011-08-02 |
| 7946465 | Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards | Kia Silverbrook, Kiangkai Tankongchumruskul | 2011-05-24 |
| 7875504 | Method of adhering wire bond loops to reduce loop height | Kia Silverbrook, Kiangkai Tankongchumruskul | 2011-01-25 |