Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063318 | Electronic component with wire bonds in low modulus fill encapsulant | Susan Williams, Laval Chung-Long-Shan | 2011-11-22 |
| 8039974 | Assembly of electronic components | Kia Silverbrook, Laval Chung-Long-Shan | 2011-10-18 |
| 8025204 | Method of wire bond encapsulation profiling | Laval Chung-Long-Shan, Kia Silverbrook | 2011-09-27 |
| 8017450 | Method of forming assymetrical encapsulant bead | Nadine Lee-Yen Chew, Elmer Dimaculangan Perez | 2011-09-13 |
| 7988033 | Method of reducing wire bond profile height in integrated circuits mounted to circuit boards | Laval Chung-Long-Shan, Kia Silverbrook | 2011-08-02 |
| 7946465 | Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards | Kia Silverbrook, Laval Chung-Long-Shan | 2011-05-24 |
| 7915091 | Method of controlling satellite drops from an encapsulant jetter | Nadine Lee-Yen Chew, Elmer Dimaculangan Perez | 2011-03-29 |
| 7875504 | Method of adhering wire bond loops to reduce loop height | Kia Silverbrook, Laval Chung-Long-Shan | 2011-01-25 |