Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026602 | Fabrication method of semiconductor device having conductive bumps | Chien-Ping Huang | 2011-09-27 |
| 7934313 | Package structure fabrication method | Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang | 2011-05-03 |
| 7863740 | Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof | Chien-Ping Huang | 2011-01-04 |