Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058722 | Power semiconductor module and method of manufacturing the same | Shan Gao, Seog Moon Choi, Tae Hyun Kim, Bum Sik Jang, Ji Hyun Park | 2011-11-15 |
| 7911043 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Seog Moon Choi, Tae Hoon Kim, Job Ha, Seung Wook Park | 2011-03-22 |