Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7911043 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Ju Pyo Hong, Seog Moon Choi, Tae Hoon Kim, Seung Wook Park | 2011-03-22 |