TU

Tetsuya Utano

SH Shinkawa: 1 patents #5 of 15Top 35%
TU Tohoku University: 1 patents #24 of 108Top 25%
Overall (2011): #149,181 of 364,097Top 45%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7975901 Bonding apparatus and wire bonding method Toru Maeda, Akinobu Teramoto 2011-07-12