Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037878 | Method for slicing workpiece by using wire saw and wire saw | Koji Kitagawa, Yukio Itoi, Tomiichi Sudou | 2011-10-18 |
| 8029339 | Workpiece double-disc grinding apparatus and workpiece double-disc grinding method | Kenji Kobayashi | 2011-10-04 |
| 7997262 | Method of improving nanotopography of surface of wafer and wire saw apparatus | Hiroshi Oishi | 2011-08-16 |